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chips

12 stories
Two RAM modules with gold connectors lying on a gray surface, the larger one on the left and a smaller one on the right
News · chips

AWS's new G7 instances won its own benchmark with half the GPUs

AWS benchmarked its Blackwell-based G7 instances against G5, G6 and G6e on 30B mixture-of-experts models. The two-GPU box beat the four-GPU boxes, the cheapest configuration and the fastest one turned out to be different machines, and the same model cost 2.5 times more per token on retrieval traffic than on chat.

Ahmad J · Sep 8, 2026 · 6 min read

Close-up of a circuit board with integrated circuits and metal traces, illuminated by warm light casting sharp shadows
News · chipsQuick

The NPU quietly became standard hardware

Dedicated AI accelerators went from a phone-camera novelty to a block Microsoft now requires by spec. What an NPU actually does, why chipmakers put one in every new laptop, and why the TOPS number on the box deserves suspicion.

Ahmad J · Aug 13, 2026 · 3 min read

A gloved hand holds a circular silicon wafer with a rainbow-colored iridescent surface against a dark background
Article · chipsDeep read

Why only a few foundries make the leading-edge chips

Leading-edge chip manufacturing has collapsed to a handful of companies, in practice one clear leader and two challengers. The reasons are structural: staggering cost, an unforgiving learning curve, and a feedback loop that punishes falling behind. Here is how it works.

Ahmad J · Jul 31, 2026 · 8 min read

A computer chip die sits at an angle on a gray surface, showing intricate patterns of fine circuitry and metal traces across its surface
Article · chipsDeep read

What a Nanometer Process Node Really Means

The number on a process node, 7nm, 3nm, now 2nm, is a marketing label, not a measurement of anything physical on the chip. Here is what it actually tracks, and the metrics that describe a chip honestly.

Ahmad J · Jul 31, 2026 · 9 min read

Green circuit board with rows of rectangular semiconductor chips sits on a wooden workbench in a laboratory setting
Article · chipsDeep read

CoWoS, SoIC, and Foveros: How Advanced Chip Packaging Actually Works

Modern chips are split into many dies, then wired back together in the package. Three technologies do that reintegration: TSMC's CoWoS and SoIC and Intel's Foveros and EMIB. Here is how 2.5D and 3D packaging physically differ, what the CoWoS variants change, and why the packaging line, not the

Ahmad J · Jul 30, 2026 · 11 min read

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