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Every story tagged advanced-packaging, newest first.

Green circuit board with rows of rectangular semiconductor chips sits on a wooden workbench in a laboratory setting

CoWoS, SoIC, and Foveros: How Advanced Chip Packaging Actually Works

Modern chips are split into many dies, then wired back together in the package. Three technologies do that reintegration: TSMC's CoWoS and SoIC and Intel's Foveros and EMIB. Here is how 2.5D and 3D packaging physically differ, what the CoWoS variants change, and why the packaging line, not the

Ahmad J · Jul 30, 2026 · 11 min read

Multiple computer chips arranged in a grid on a dark substrate with visible circuit paths and copper-colored component details

Article · chipsDeep read

The Foundry Moat Moved to the Package

For twenty years the chip moat was the transistor. Since 2018 it has moved to the package: whoever runs the CoWoS, SoIC, and Foveros line decides whether an AI accelerator ships at volume. An interactive research edition.

Ahmad J · Jul 27, 2026 · 5 min read