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#advanced-packaging

Every story tagged advanced-packaging, newest first.

Green circuit board with rows of rectangular semiconductor chips sits on a wooden workbench in a laboratory setting

CoWoS, SoIC, and Foveros: How Advanced Chip Packaging Actually Works

CoWoS puts dies side by side on an interposer; TSMC's SoIC and Intel's Foveros Direct stack them with copper hybrid bonds. How they differ, who uses them.

Ahmad J · Jul 30, 2026 · 11 min read

Multiple computer chips arranged in a grid on a dark substrate with visible circuit paths and copper-colored component details

Article · chipsDeep read

The Foundry Moat Moved to the Package

For twenty years the chip moat was the transistor. Since 2018 it has moved to the package: whoever runs the CoWoS, SoIC, and Foveros line decides whether an AI accelerator ships at volume. An interactive research edition.

Ahmad J · Jul 27, 2026 · 5 min read